ELECTROLESS METAL PLATING METHOD

• Main Authors: BOYA RISTA MARKOVICH, GERALD WALTER JONES, HEIKE MARCELLO, DAVID JOHN RUSSELL
• Format: Patent
• Language: English
• Published: 16.11.1999
• Edition: 6
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; CINEMATOGRAPHY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a method for selectively applying electroless plating of metal, particularly gold and copper on a substrate such as a circuited substrate. SOLUTION: This method contains a stage in which the surface of a substrate 12 is applied with a dielectric permanent plating resist 16 contg. about 10 to 80% phenoxypolyol resin of about 40,000 to 130,000 molecular weight which is a condensate of epichloro-hydrin and bisphenol A, about 20 to 90% epoxidated multifunctional bisphenol A-formaldehyde-novolak resin of about 4,000 to 10,000 molecular weight, about 35 to 50% diglycidyl-ether of bisphenol A of about 600 to 2,500 and a cationic photoinitiator and capable of photoimaging by curing, a stage in which the permanent plating resist 16 is photopatterned, and the opening 18 exposing the region of the substrate 12 is formed therein and a stage in which the exposed region of the substrate 12 is applied with electroless plating of metal.