EVALUATION OF HEAT TREATMENT EQUIPMENT FOR SUBSTRATE

• Main Author: HISAI AKIHIRO
• Format: Patent
• Language: English
• Published: 05.11.1999
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To simplify the evaluation work by a method, wherein a substrate applied on its entire surface with a film forming liquid thin is heat-treated, the film thickness distribution of a film formed on the surface of the substrate is measured, and the uniformity of the temperature on the surface of the substrate is evaluated based on the measurement result. SOLUTION: A photoresist as a film forming liquid is applied thin onto the entire surface of a substrate. The substrate applying photoresist thereon is located in a baking unit to be heat-treated. After the heat treatment, the thickness of the photoresist film formed on the surface of the substrate is measured at a plurality of points to measure the film thickness distribution. From the measurement results, the uniformity of temperature on the surface of the substrate in the baking unit is evaluated. As a result of this method, a good correlation can be obtained between the evaluation result and the actual processing result of the heat treatment of the substrate, and the evaluation work can be simplified.