SEMICONDUCTOR DEVICE AND RESIN COMPOSITION FOR SEMICONDUCTOR SEALING

• Main Authors: KAWAHARA TOSHISANE, TAKIGAWA YUKIO, TSUTSUMI YASUAKI, TANAKA MASAYUKI
• Format: Patent
• Language: English
• Published: 19.10.1999
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a chip size semiconductor device of high reliability at a low cost, and resin composition for sealing semiconductor in which an excellent film can be formed on a wafer, warp of the wafer is small, and reliability is high, in a method manufacturing a semiconductor device by collectively sealing a semiconductor element in the state of a wafer. SOLUTION: In a semiconductor device in which a film of resin composition is formed on one surface of a semiconductor element, the coefficient of linear expansion of glass transition temperature or lower of the resin composition is 60×10<-6> /K or lower, and the coefficient of linear expansion of the glass transition temperature or higher is 140×10<-6> /K or lower. As to resin composition for sealing the semiconductor device, the coefficient of linear expansion of glass transition temperature or lower is 60×10<-6> /K or lower, and the coefficient of linear expansion of the glass transition temperature or higher is 140×10<-6> /K or lower.