SURFACE POLISHING LIQUID COMPOSITION FOR SEMICONDUCTOR PRODUCT

PROBLEM TO BE SOLVED: To provide a surface polishing liquid composition for semiconductor products, having excellent polishing efficiency and exhibiting stable good polishing performances. SOLUTION: The surface polishing liquid composition comprises an alkaline silica sol containing a water-soluble...

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Bibliographic Details
Main Authors YANAGIHARA KAZUAKI, TAKAHATA TADAO
Format Patent
LanguageEnglish
Published 12.10.1999
Edition6
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOUNDS THEREOF
DRESSING OR CONDITIONING OF ABRADING SURFACES
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
INORGANIC CHEMISTRY
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-METALLIC ELEMENTS
PAINTS
PERFORMING OPERATIONS
POLISHES
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a surface polishing liquid composition for semiconductor products, having excellent polishing efficiency and exhibiting stable good polishing performances. SOLUTION: The surface polishing liquid composition comprises an alkaline silica sol containing a water-soluble organic amine such as aminoethylethanolamine, monoethanolamine, monomethylamine, hydrazine, ethylenediamine, diethylenetriamine, or tetramethylammonium hydroxide, particularly desirably, such an alkaline silica sol having a low metal content.
Bibliography:Application Number: JP19980079704