METHOD AND DEVICE FOR CLEANING SUBSTRATE

• Main Authors: YATSUNO KOMEI, KOJIMA KENICHI
• Format: Patent
• Language: English
• Published: 08.10.1999
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; CLEANING; CLEANING IN GENERAL; CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To securely and efficiently remove the organism of resist on a substrate without using organic solvent and the like and without damaging an inorganic substrate element, by cleaning the substrate to which an organism is adhered by means of water (supercriticial water) in a supercritical state. SOLUTION: Substrates 1... to which resist films are adhered are set in a holder 3. The holder 3 holds the substrates 1... by detaching them in a shelf- form and supercritical water freely circulates between the intervals. The holder 3 holding the substrates 1... is inserted into a cleaning room 21 and the cleaning room 21 is closely and hermetically sealed with pressure tightness by a cover member 20b. Then, supercritical water is generated in a thin pipe 131 with a water supply tank 11, a high pressure pump 12 and a heat exchanger 13. A flow rate adjusting valve 14 is opened and supercritical water is circulated in the cleaning room 21. When the holder 3 is taken out after cleaning is executed for prescribed time, the substrates 1... from which the resist films are removed in a state where they are held by the holder 3 are obtained.