SEMICONDUCTOR ELEMENT AND ITS MANUFACTURE

PROBLEM TO BE SOLVED: To set topography accompanied by a detection element not so as to affect a formation of transistors on a face of a substrate, by a method wherein the detection element is, at least partially, disposed in a recessed cavity. SOLUTION: Patterning is performed in a conductive subst...

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Bibliographic Details
Main Authors GER MUH-LING, BERGSTROM PAUL L
Format Patent
LanguageEnglish
Published 24.09.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PHYSICS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
TESTING
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To set topography accompanied by a detection element not so as to affect a formation of transistors on a face of a substrate, by a method wherein the detection element is, at least partially, disposed in a recessed cavity. SOLUTION: Patterning is performed in a conductive substance 18, and a ring 49 is left along a side face 12 of the cavity 11. Further, the detection element 30 contains a vibration mass 38 moving in response to acceleration and a spring region 36 for use in fitting it on the ring 49. The ring 49, the vibration mass 38 and the spring region 36 are formed by a conductive substance 18. A finger 28 of the detection element 30 is fitted on the vibration mass 38, and moves together with moving of the vibration mass 38. As the results of patterning of a temporary structure, the finger 27 is fitted on a clamp region 35 under the detection element 30. As the results, moving of the vibration mass 38 is detected by using capacity coupling between the finger 27 and the finger 28, to detect acceleration applied on a semiconductor element.
Bibliography:Application Number: JP19980351719