MANUFACTURE OF MICROLENS

• Main Authors: KOGA OSAMU, ISHIMATSU TADASHI, KITAMURA TOMOHITO
• Format: Patent
• Language: English
• Published: 07.09.1999
• Edition: 6
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTROGRAPHY; FREQUENCY-CHANGING; HOLOGRAPHY; MATERIALS THEREFOR; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICAL LOGIC ELEMENTS; OPTICS; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To improve transmissivity in a microlens by irradiating a UV beam removing the UV beam of a specified wavelength or below on a photosensitive resin forming a pattern, then, heating the pattern and forming the microlens. SOLUTION: A photosensitive resin 2 is applied on a substrate 1. Then, the resin 2 is exposed by irradiating it with the UV beam 10 by using a photomask 3. The resin 2 is immersed and developed after exposure and the pattern 4 of the photosensitive resin 2 is formed. Then, the whole surface of the pattern 4 of the photosensitive resin 2 is irradiated by the UV beam 20 removing the UV beam with the wavelength of nearly 300 nm or below. In such a case, a super-high pressure mercury vapor lamp is used as a light source and a filter 30 for removing the UV beam with the wavelength of nearly 300 nm or below is used. As an irradiation amount, nearly 14-140 mj/cm (at 365 nm) per the film thickness 1 μm of the photosensitive resin 2 is suitable. Further, as the filter removing, the UV beam with the wavelength of nearly 300 nm or below, quartz is suitable. Thus, the hardening on the surface of the pattern 4 is prevented.