MANUFACTURE OF BOARD FOR FLOOR HEATING

PROBLEM TO BE SOLVED: To manufacture a board for floor heating utilized as a 'tatami' mat floor having excellent a thermal conductivity easily at a low cost in various sizes including thickness and shapes. SOLUTION: A primary board material 31, in which aluminum foil 5a is bonded on both s...

Full description

Saved in:
Bibliographic Details
Main Author KENMOCHI KIYOSHI
Format Patent
LanguageEnglish
Published 31.08.1999
Edition6
Subjects
BLASTING
BUILDING
DOMESTIC HOT-WATER SUPPLY SYSTEMS
DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATINGSYSTEMS
ELEMENTS OR COMPONENTS THEREFOR
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
FIXED CONSTRUCTIONS
HEATING
LIGHTING
MECHANICAL ENGINEERING
RANGES
VENTILATING
WEAPONS
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To manufacture a board for floor heating utilized as a 'tatami' mat floor having excellent a thermal conductivity easily at a low cost in various sizes including thickness and shapes. SOLUTION: A primary board material 31, in which aluminum foil 5a is bonded on both surfaces of a foamed resin 2a, is prepared first. A block material 32 is prepared by bonding a plurality of the primary board materials 31 in the direction that the aluminum foil 5a is arranged in parallel. A second board material 33 is drawn up by cutting the block material 32 in the orthogonal direction to the aluminum foil 5a. Aluminum foil as heat-receiving sections and heat-dissipating sections is seamed on both surfaces of the secondary board material 33 together with 'tatami' mat woven fabrics, pressure-resisting boards, cushioning materials, etc. Accordingly, heat from a heat source is transmitted excellently up to a 'tatami' mat facing through the heat-receiving sections and heat transfer sections and the heat dissipating sections consisting of aluminum foil 5a in the secondary board material 33 at the time of usage.
Bibliography:Application Number: JP19980038698