ROUGHENING OF SURFACE OF RESIN LAYER

• Main Authors: AIDA SHOJIRO, ITO KENICHI
• Format: Patent
• Language: English
• Published: 31.08.1999
• Edition: 6
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

PROBLEM TO BE SOLVED: To provide a method for roughening the surface of a resin layer, capable of roughening the surface of the resin layer into a rough surface having excellent adhesivity to plated metal layers, etc., and useful for printed circuit boards, etc., by treating the surface of a specific resin layer containing a filler with an organic solvent and subsequently further treating the treated surface of the resin layer with a filler-soluble aqueous solution. SOLUTION: This method for roughening the surface of a resin layer comprises forming (A) a resin layer from a resin composition, bringing the surface of the layer A into contact with an organic solvent such as an aromatic hydrocarbon and subsequently further bringing the treated surface of the layer A into contact with a filler-soluble aqueous solution (for example, an aqueous solution of an acid, alkali or acidic compound) to remove the filler A' from the resin layer A. The resin composition comprises a ring structure-containing polymer [for example, a (hydrogenated) norbornene-based polymer or a (hydrogenated) cyclic conjugated dienic polymer], (A') a filler (for example, a filler comprising calcium carbonate or silica and having an average particle diameter of 0.1-50 μm) and, if necessary, further a curing agent.