METHOD OF INSPECTING BOARD HAVING VIA HOLE

PROBLEM TO BE SOLVED: To provide a method of inspecting a board having a simple and accurate via hole, which is able to inspect the charge condition of conductive paste before conducting multilayering of a substrate after charge of conductive paste. SOLUTION: This method has a step for applying line...

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Bibliographic Details
Main Authors NAGASAKI TATSUO, NOMURA TAKESHI, KUBO HIROYASU
Format Patent
LanguageEnglish
Published 09.07.1999
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
PRINTED CIRCUITS
TESTING
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Summary:PROBLEM TO BE SOLVED: To provide a method of inspecting a board having a simple and accurate via hole, which is able to inspect the charge condition of conductive paste before conducting multilayering of a substrate after charge of conductive paste. SOLUTION: This method has a step for applying linear illumination light to the surface of a substrate 11 having a via hole charged with conductive paste 13, a step for detecting the flexion of the linear illumination light 17 caused by the irregularities at the surface of the said substrate, and a step for getting the difference in level of the irregularities at the surface of the said substrate from the detected flexion and detecting the quantity of dent to the substrate 11 of the conductive paste 13 from the obtained difference in levels.
Bibliography:Application Number: JP19970354952