MANUFACTURING MULTILAYERED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayred wiring board which maintains a photolighographic and plating functions and can display adequate characteristics as insulation function. SOLUTION: In a wiring board manufacturing method having steps of forming an insulation laye...

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Bibliographic Details
Main Authors FUKAI HIROYUKI, MORITA MASAKI, TAKANEZAWA SHIN, HATAKEYAMA SHUICHI, IRINO TETSURO
Format Patent
LanguageEnglish
Published 09.07.1999
Edition6
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CINEMATOGRAPHY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayred wiring board which maintains a photolighographic and plating functions and can display adequate characteristics as insulation function. SOLUTION: In a wiring board manufacturing method having steps of forming an insulation layer 3 on a circuit surface of an insulation board having a first circuit 1, applying image exposure, developing, after-exposure, and after-heating to the insulation layer, Cu plating to form a second circuit on the insulation layer surface and layer interconnection of via holes 4 to from a multilayered structure, and the board surface temp. is to be conducted in the after-exposure step ranges of 50 deg.C to 120 deg.C.
Bibliography:Application Number: JP19970350267