ELECTRONIC CIRCUIT PACKAGE COOLING DEVICE

• Main Authors: KAWANO RYUSUKE, KAIZU KATSUMI, YAMANAKA NAOAKI, OKAZAKI KATSUHIKO, HARADA AKIO
• Format: Patent
• Language: English
• Published: 22.06.1999
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To lessen an arrangement pitch between vertically arranged electronic circuit packages by a method, wherein the packages are respetively coupled thermally with heat transmission plates in a state such, that the packages face directly or indirectly the plates, the end part on one side of the end parts of each heat transmission plate is practically used as one part of a duct, and electrically-driven fans for sending the wind to the duct are provided. SOLUTION: Electronic circuit packages 11A and 11B are respectively coupled thermally with heat transmission plates 14A and 14B via aluminium plates 13A and 13B, and the plates 14A and 14B are thermally coupled with a radiation fin 17. Accordingly, heat generated from heating elements of the packages 11A and 11B are transferred from the plates 13A and 13B to the plates 14A and 14B, are transferred to the fin 17 by the plates 14A and 14B and here, the heats are cooled with the wind generated by electrically-driven fans 18 and 19. The wind is sent to the side parts of the fin 17 and as the heats, which are generated from the packages 11A and 11B, can be dissipated by cooling forcedly the fin 17, the arrangement pitch between the vertically arranged pakcages 11A and 11B can be lessened.