CONNECTOR FOR BOARD

PROBLEM TO BE SOLVED: To prevent the generation of soldering failures such as solder bridge between adjacent leads by cream solder being pushed out to the outside of the pattern of a connection part by being crushed with the lead in the mounting of a cream solder coated component resulting from narr...

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Bibliographic Details
Main Author ARAKAWA KATSUHIRO
Format Patent
LanguageEnglish
Published 22.06.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CURRENT COLLECTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To prevent the generation of soldering failures such as solder bridge between adjacent leads by cream solder being pushed out to the outside of the pattern of a connection part by being crushed with the lead in the mounting of a cream solder coated component resulting from narrow soldering lead pitch accompanied by the miniturization and the densification of a connector. SOLUTION: A recess which ranges over the width of a lead 2 in the height direction is continuously formed in the length direction of the lead 2 on the surface to be soldered of the lead 2, extruding of paste 4 to the outside of a conductor pattern 5 by the lead 2 generating, when a connector 1 is pressed against a circuit board 6 for mounting is absorbed by the recess, the amount of the overflowed paste 4 to the outside of the conductor pattern 5 is reduced. The overflowed paste 4 is sucked up by the capillary phenomenon of the recess of the lead 2 by reflow and housed in the conductor pattern 5. As a result, solder bridge after reflow caused by the contact with the adjacent paste 4 can be decreased.
Bibliography:Application Number: JP19970332668