METHOD AND EQUIPMENT FOR ELECTRONIC COMPONENT MOUNTING

• Main Authors: HATTORI YOSHIYUKI, KURATA HIROAKI
• Format: Patent
• Language: English
• Published: 21.05.1999
• Edition: 6
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To automatically prepare definition data as to an electronic component used in an adhesive agent applicator from data formed through an electronic component mounting equipment or a data preparation software. SOLUTION: An electronic component mounting equipment is equipment with an input/output part through which data are inputted from outside, a data preparation part 2 which automatically sets up a nozzle pattern as original data of an adhesive agent applicator from the type and size of the electronic component, a data editing part 3 which is capable of referring to the generated data or directly updating data, and a data transfer part 4 which determines a tank that is actuated from the nozzle pattern of an application nozzle mounted on the applicator. The electronic component mounting equipment starts to operate switching a tank from one to another by an equipment operating part 5 according to a nozzle pattern which is automatically set, whereby an operator is capable of saving his labor hour when the type of products is changed, various kinds of electronic part data are not required to be controlled in a single product line, and a type control of electronic components to be used can be carried out and data can be kept high in maintainability.