CERAMIC MULTI-LAYER SUBSTRATE AND METHOD FOR MANUFACTURING IT
PROBLEM TO BE SOLVED: To provide more minute line width of a conductor pattern and to reduce a wiring resistance for higher wiring density by printing a first insulating layer on a first conductor pattern where a pattern of a conductive paste is transferred onto a ceramics substrate and sintered, an...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
30.04.1999
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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