CERAMIC MULTI-LAYER SUBSTRATE AND METHOD FOR MANUFACTURING IT

PROBLEM TO BE SOLVED: To provide more minute line width of a conductor pattern and to reduce a wiring resistance for higher wiring density by printing a first insulating layer on a first conductor pattern where a pattern of a conductive paste is transferred onto a ceramics substrate and sintered, an...

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Bibliographic Details
Main Authors MATSUNAGA HAYASHI, HAYAMA MASAAKI, MORI NOBORU
Format Patent
LanguageEnglish
Published 30.04.1999
Edition6
Subjects
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