CERAMIC MULTI-LAYER SUBSTRATE AND METHOD FOR MANUFACTURING IT

• Main Authors: MATSUNAGA HAYASHI, HAYAMA MASAAKI, MORI NOBORU
• Format: Patent
• Language: English
• Published: 30.04.1999
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide more minute line width of a conductor pattern and to reduce a wiring resistance for higher wiring density by printing a first insulating layer on a first conductor pattern where a pattern of a conductive paste is transferred onto a ceramics substrate and sintered, and then printing a second conductor pattern of a it. SOLUTION: On the surface of a flexible resin base material, fine first and second grooves are formed, used as an intaglio, which is filled with a conductor paste, and then deareated and dried. In order to compensate for reduction in volume due to drying, a process where an additional conductor paste is re-filled, re-deareated, and re-dried is repeated by a specified number of times so that the groove part is filled with a condensed conductor material. The intaglio and a ceramics substrate 2 are pasted together, and the conductor material packed in the groove part is transferred onto the ceramics substrate 2 and then sintered for a fine first conductor pattern 3. A first insulating layer 21 is printed on the first conductor pattern, and further, a second conductor pattern 4 is printed on the first insulating layer 21, which is to be a ceramics multi-layer substrate.