PHOTOSENSITIVE RESIN COMPOSITION

• Main Authors: TACHIBANA RINZOU, YANAGAWA MAKOTO, KIYOTA TATSUYA, MIURA ICHIRO
• Format: Patent
• Language: English
• Published: 30.04.1999
• Edition: 6
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition hardenable by light and developable with an aqueous solution of a dilute alkali and forming a pattern superior in resistances to heat and humidity and electric insulation and resistance to chemicals, and flexibility, by incorporating an active energy ray-hardenable resin, a specified N-substituted dicyandiamide derivative, a reactive diluent, a photopolymerization initiator, and an epoxy type heat-hardenable compound. SOLUTION: The photosensitive resin composition contains the active energy ray-hardenable resin having at least 2 ethylenically unsaturated bonds, the N-substituted dicyanidiamide derivative represented by formula I, the photopolymerization initiator, the reactive diluent, and the epoxy type heat hardenable compound. In formulae I and II, X is an alkyl group in the formula I, and an aryl or aralkyl group in the formula II; R is a lower alkyl or lower alkoxy or hydroxy or amino or amino substituted by lower alkyl group; (n) is an integer of 0-3; (m) is an integer of 0-4; and when X is an alkyl group, a usually 1-12C group.