MANUFACTURE OF MULTILAYER WIRING BOARD

• Main Authors: MORITA MASAKI, YAMADERA TAKASHI, TAKANEZAWA SHIN, HATAKEYAMA SHUICHI, TAKEUCHI KAZUMASA
• Format: Patent
• Language: English
• Published: 23.04.1999
• Edition: 6
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To improve the surface flatness of an insulating layer by forming an interlayer insulating film on the conductor circuit made on an insulating board, using a metallic press roll. SOLUTION: A through hole is made by drilling a laminate both whose sides are covered with copper an...