MANUFACTURE OF MULTILAYER WIRING BOARD

• Main Authors: MORITA MASAKI, YAMADERA TAKASHI, TAKANEZAWA SHIN, HATAKEYAMA SHUICHI, TAKEUCHI KAZUMASA
• Format: Patent
• Language: English
• Published: 23.04.1999
• Edition: 6
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To improve the surface flatness of an insulating layer by forming an interlayer insulating film on the conductor circuit made on an insulating board, using a metallic press roll. SOLUTION: A through hole is made by drilling a laminate both whose sides are covered with copper and plating the inner face of the drill hole, and etching resist is provided to complete a wiring board where a conductor circuit 1 is made. Insulating films 5 and 5' fitted with supporting films are veered out of film supply rolls 3 to the supporting film 6 on the conductor circuit 1 made on an insulating substrate 2, and they are heated and pressurized with a metallic press roll 4 for lamination. After this lamination, the supporting film 6 is stripped, and a second laminate is applied onto the insulating layer film made of the first laminate with a metallic press roll 4. As the interlayer insulating film, the mixture ratio of epoxy resin and rubber components becomes important for the quantity of flow and surface flatness. The surface can be made with good flatness by an insulating layer build-up formation method this way.