MANUFACTURE OF MULTILAYERED WIRING BOARD USING INSULATING RESIN CONTAINING SPECIFIED OXIDATION INHIBITOR

• Main Authors: FUKAI HIROYUKI, MORITA MASAKI, TAKANEZAWA SHIN, TAKEUCHI KAZUMASA, HATAKEYAMA SHUICHI
• Format: Patent
• Language: English
• Published: 13.04.1999
• Edition: 6
• Subjects: ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; POLISHES; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayered wiring board having an insulating layer, wherein a microscopic via hole can be formed while the layer maintains heat resistance and insulation reliability in a moistening state. SOLUTION: In a method for manufacturing a wiring board, which is formed into a multilayered structure by a method, wherein an insulating layer 3 is formed on the surface of a first circuit 2 on an insulating board 1 with the first circuit 2 formed thereon, a via hole 6 for connecting the layer 3 with the circuit 2 is formed in the layer 3, second circuits 8 are formed on the surface of the layer 3 by a copper plating and the inter-layer connection of the via hole 6 is made, a photosensitive resin containing a hindered phenol oxidation inhibitor as its essential component or an insulating resin concurrently using photosensitivity and thermosetting is used for the layer 3.