SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To greatly reduce the capacitance between lines, without increasing the common signal line pitch by forming adjacent signal wirings on different wiring layers. SOLUTION: A decoder wiring bus 6 is composed of four signal wirings 6a-6d, formed on alternately insulated wiring laye...

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Bibliographic Details
Main Authors SATO MASATOSHI, HONMA KAZUKI, IKEDA MASATO
Format Patent
LanguageEnglish
Published 10.04.1998
Edition6
Subjects
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Summary:PROBLEM TO BE SOLVED: To greatly reduce the capacitance between lines, without increasing the common signal line pitch by forming adjacent signal wirings on different wiring layers. SOLUTION: A decoder wiring bus 6 is composed of four signal wirings 6a-6d, formed on alternately insulated wiring layers. The spacings between the signal wirings 6a-6d are smaller than those of the conventional. Because the wirings 6a-6d are formed on the alternately insulated wiring layers, the signal wirngs 6b, 6d are moved to a first wiring layer through contacts 7 from a second wiring layer, and the signal wiring 6c is moved and formed from the first wiring layer to the second wiring layer through contacts 7. The signal wirings 6a-6d are moved and formed repeatedly between the first and second wiring layers at every specified lengths, thus adjacent signal wirings are not formed on the same wiring layer.
Bibliography:Application Number: JP19960238907