SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To greatly reduce the capacitance between lines, without increasing the common signal line pitch by forming adjacent signal wirings on different wiring layers. SOLUTION: A decoder wiring bus 6 is composed of four signal wirings 6a-6d, formed on alternately insulated wiring laye...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
10.04.1998
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To greatly reduce the capacitance between lines, without increasing the common signal line pitch by forming adjacent signal wirings on different wiring layers. SOLUTION: A decoder wiring bus 6 is composed of four signal wirings 6a-6d, formed on alternately insulated wiring layers. The spacings between the signal wirings 6a-6d are smaller than those of the conventional. Because the wirings 6a-6d are formed on the alternately insulated wiring layers, the signal wirngs 6b, 6d are moved to a first wiring layer through contacts 7 from a second wiring layer, and the signal wiring 6c is moved and formed from the first wiring layer to the second wiring layer through contacts 7. The signal wirings 6a-6d are moved and formed repeatedly between the first and second wiring layers at every specified lengths, thus adjacent signal wirings are not formed on the same wiring layer. |
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Bibliography: | Application Number: JP19960238907 |