DEVICE FOR MANUFACTURING RESIN SEALED SEMICONDUCTOR AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a manufacturing device for a semiconductor device which suppresses generation of voids, concaves, cracks and so on by resin clogging at an air bent part of a sealing mold during resin sealing. SOLUTION: When a semiconductor manufacturing device 100 is so comprised as...

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Bibliographic Details
Main Author NODA TOSHIO
Format Patent
LanguageEnglish
Published 10.04.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a manufacturing device for a semiconductor device which suppresses generation of voids, concaves, cracks and so on by resin clogging at an air bent part of a sealing mold during resin sealing. SOLUTION: When a semiconductor manufacturing device 100 is so comprised as resin sealing of a resin sealed objective 120 to be made, the semiconductor manufacturing device 100 is made to contain a cavity part 103 which internally supports the resin sealed objective 120. The device is also made to contain an air bent part 109 which is provided at a part of the cavity part 103 to exhaust air in a resin supplying passage 121 provided at a part of the cavity part 103 and of the inside of the cavity part 103, because resin material 107 to make resin sealing of the resin sealed objective 120 is attempted to introduce into the cavity part 103. Additionally an aperture adjusting means 130 which can adjust an aperture of the air bent part 109 is provided at the air bent part 109.
Bibliography:Application Number: JP19960241485