MANUFACTURE OF MULTILAYER WIRING BOARD AND WIRING FORMING DEVICE

• Main Authors: SATO SHIGETADA, MATSUYAMA HARUHIKO, KANNO KENICHI
• Format: Patent
• Language: English
• Published: 10.04.1998
• Edition: 6
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To collectively form a thin film-like wiring with high precision over the whole area of a ceramic multilayer wiring base including distortion deforma tion by calculating the correction quantity of the multilayer wiring board neces sary for positioning, and controlling the position of the multilayer wiring board on the basis of this correction quantity. SOLUTION: An LSI loading area and mask positioning through-hole on a base 1 is recognized by a base surface reader, and the recognized image data is transmitted to a control computer 14. The control computer 14 performs a prescribed arithmetic processing to the transmitted image data, whereby the position coordinate is calculated. The calculated position coordinate of LSI loading area and the position coordinate on a photo mask corresponding to the individual LSI loading position coordinate are subjected to a prescribed arithmetic processing (for example, arithmetic processing by minimum square method), whereby a multilayer wiring board correction quantity (rotating angle and moving quantity of position) necessary for position is calculated. On the basis of the calculated correcting quantity, the position of the multilayer wiring board is controlled.