SEMICONDUCTOR PACKAGE STRUCTURE
PROBLEM TO BE SOLVED: To enable an insulating adhesive agent layer provided to a semiconductor package to be easily controlled in thickness by a method wherein insulating beads of prescribed in diameter are contained in the insulating adhesive agent to ensure a second semiconductor chip and a die pa...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
31.03.1998
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To enable an insulating adhesive agent layer provided to a semiconductor package to be easily controlled in thickness by a method wherein insulating beads of prescribed in diameter are contained in the insulating adhesive agent to ensure a second semiconductor chip and a die pad of a constant breakdown voltage between them. SOLUTION: A power IC 2 such as a MOSFET or a bipolar IC and a control IC 1 are located on a die pad 5 provided to a lead frame. At this point, the rear surface of the power IC 2 functions usually as a drain, so that the IC 2 is fixed to the die pad 5 with conductive solder adhesive agent 4. The control IC 1 is required to be electrically isolated from the die pad 5, so that it is bonded to the die pad 5 with an insulating epoxy adhesive agent 3. At this point, solid insulating beads 9 are added to the insulating epoxy adhesive agent 3. Therefore, the epoxy adhesive agent layer 3 is precisely controlled in thickness by the solid insulating beads 9. |
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Bibliography: | Application Number: JP19970105013 |