SEMICONDUCTOR PACKAGE STRUCTURE

• Main Authors: BOKU SHOKON, NAN JIHAKU, KEN DAIKUN
• Format: Patent
• Language: English
• Published: 31.03.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To enable an insulating adhesive agent layer provided to a semiconductor package to be easily controlled in thickness by a method wherein insulating beads of prescribed in diameter are contained in the insulating adhesive agent to ensure a second semiconductor chip and a die pad of a constant breakdown voltage between them. SOLUTION: A power IC 2 such as a MOSFET or a bipolar IC and a control IC 1 are located on a die pad 5 provided to a lead frame. At this point, the rear surface of the power IC 2 functions usually as a drain, so that the IC 2 is fixed to the die pad 5 with conductive solder adhesive agent 4. The control IC 1 is required to be electrically isolated from the die pad 5, so that it is bonded to the die pad 5 with an insulating epoxy adhesive agent 3. At this point, solid insulating beads 9 are added to the insulating epoxy adhesive agent 3. Therefore, the epoxy adhesive agent layer 3 is precisely controlled in thickness by the solid insulating beads 9.