ULTRASONIC GANG BONDING TOOL

PROBLEM TO BE SOLVED: To make feasibly of the thermal and ultrasonic bonding junction by together with semiconductor element pad and tape carrier inner lead, by providing crossed protrusions on the parts corresponding the respectful inner leads on a bonding tool junction surface. SOLUTION: Crossed p...

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Bibliographic Details
Main Author TAKAMURA KEIJI
Format Patent
LanguageEnglish
Published 10.03.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To make feasibly of the thermal and ultrasonic bonding junction by together with semiconductor element pad and tape carrier inner lead, by providing crossed protrusions on the parts corresponding the respectful inner leads on a bonding tool junction surface. SOLUTION: Crossed protrusions 111, 131 in even level are provided on a protrusion 11 of a bonding tool 10. Likewise, the same crossed protrusions 121, 141 in even level are provided on the other protrusions 12, 14 with the level to be set up at higher level than that of the crossed protrusions 111, 131. On the other hand, the semiconductor element pad and the tape carrier inner lead are previously aligned by an alignment mechanism so as to be fixed on chip heating stage for fixing and heating the chip. Next, the semiconductor element inner leads are pressed for alignment with a bonding tool fixed to an ultrasonic horn. Finally, the whole lead is pressed with a specific pressure to oscillate the ultrasonic phone for junction the semiconductor element and the inner lead.
Bibliography:Application Number: JP19960227241