RESIN SEALED SEMICONDUCTOR DEVICE AND MANUFACTURE THEREFOR

PROBLEM TO BE SOLVED: To provide the resin sealed semiconductor device of high reliability and high manufacture yield for surely preventing the shift in vertical directions and horizontal directions even in a semiconductor device in which an island is positioned at the center and the manufacturing m...

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Bibliographic Details
Main Author YAJIMA KEI
Format Patent
LanguageEnglish
Published 06.03.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide the resin sealed semiconductor device of high reliability and high manufacture yield for surely preventing the shift in vertical directions and horizontal directions even in a semiconductor device in which an island is positioned at the center and the manufacturing method. SOLUTION: In this manufacture of the semiconductor device for holding a lead frame 1 which carries a semiconductor element 5 on the island 2 between upper and lower dies 11 and 12, and for injecting resin inside a cavity 10 formed by the upper and lower dies to perform resin sealing, a position fixing hole 7 is opened through the island 2, a position fixing pin 8 is inserted through the position fixing hole 7 and the resin is injected while holding both end parts of the position fixing pin 8 between the upper and lower dies. The shift of the island 2 in the vertical directions and the horizontal directions is prevented by the position fixing pin 8, so that the semiconductor device of high reliability is manufactured.
Bibliography:Application Number: JP19960215628