PLATING BATH OF NICKEL, COBALT OR NICKEL-COBALT ALLOY AND PHOSPHORUS AND PLATING METHOD

PROBLEM TO BE SOLVED: To provide a plating bath with the cathode current efficiency and anode current efficiency well-balanced, hence without the metallic ion concn. being remakably increased, capable of maintaining the metallic ion concn. at a fixed level by selecting the anode current density and...

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Bibliographic Details
Main Authors OKUDA JIRO, IEJI TOMOMI, NAKATANI SEIJI, MURAKAMI TORU, OKA TERUYA
Format Patent
LanguageEnglish
Published 03.03.1998
Edition6
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:PROBLEM TO BE SOLVED: To provide a plating bath with the cathode current efficiency and anode current efficiency well-balanced, hence without the metallic ion concn. being remakably increased, capable of maintaining the metallic ion concn. at a fixed level by selecting the anode current density and anode and capable of providing a plating film having a stabilized content of P over a long period. SOLUTION: This plating bath of nickel, cobalt or nickel-cobalt alloy and phosphorus for a soluble anode contains 6-30g/l water-soluble salt of metal selected from nickel and cobalt as the metallic ion, 150-800g/l at least one kind among the water-soluble sulfate, sulfamate and methane sulfamate of the metal selected from alkali metals and alkaline-earth metals as the conductive salt, 1-100g/l phosphorous acid or its salt and <=100mg/l halogen ion and is controlled to pH0.8 to 5.
Bibliography:Application Number: JP19960232483