PRODUCTION OF ELECTRONIC PART

PROBLEM TO BE SOLVED: To prevent an element from deteriorating in its characteristics due to adhesion of adhesive, etc., by sealing at the same tome as fixing the element and connection with an external electrode without using a lead wire and an adhesive. SOLUTION: A case 11, in which, for example,...

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Bibliographic Details
Main Authors NAKAMURA SADASHI, OISHI KUNIHIKO, UMEDA SHINJI, ANDO DAIZO, YUZAWA TETSUO
Format Patent
LanguageEnglish
Published 13.01.1998
Edition6
Subjects
BASIC ELECTRONIC CIRCUITRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
RESONATORS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To prevent an element from deteriorating in its characteristics due to adhesion of adhesive, etc., by sealing at the same tome as fixing the element and connection with an external electrode without using a lead wire and an adhesive. SOLUTION: A case 11, in which, for example, a SAW filter chip 3 is accommodated in an inner space, a piercing hole 6 is arranged at a wall part corresponding to an electrode 9 of SAW filter chip 3, at least the surface of inner face/wall face of piercing hole 6 is arranged with a gold or tin metallic film 7 and which is made of glass material, is immersed, in a nitrogen atmosphere container 15, as a first process, in a solder bath 12 of a solder 8 in molten and jetting state while the wall face at the side of piercing hole 6 is arranged to rear face, as a second process, the case 11 is elevated up to the outside of molten solder bath 12 at low speed.
Bibliography:Application Number: JP19960155141