IC MODULE

• Main Authors: SUEYOSHI TOSHINOBU, TAMADA KANAME, FUKUHARA MASAKI
• Format: Patent
• Language: English
• Published: 03.03.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; BOOK COVERS; BOOKBINDING; CALCULATING; COMPUTING; COUNTING; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILES; HANDLING RECORD CARRIERS; LOOSE LEAVES; MOVABLE-STRIP WRITING OR READING APPARATUS; PERFORMING OPERATIONS; PHYSICS; PRESENTATION OF DATA; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR; RECOGNITION OF DATA; RECORD CARRIERS; SEMICONDUCTOR DEVICES; SPECIAL PRINTED MATTER; TRANSPORTING

PROBLEM TO BE SOLVED: To provide an IC module of less total thickness and sufficient structural strength which is provided with an extremely thin IC chip to be bent in the free state, bonded properly with a module base and suitable for a non- contact type IC card. SOLUTION: The thickness of an IC chip 2 is set to 100μm or less. The IC chip 2 is fitted with its surface facing downward on a module base 1 to reduce the thickness of a bonded structural section. The total thickness of the IC module is reduced, while having the thickness of the module base 1 is ensured sufficiently for the requirement by the arrangement. The IC chip 2 is bonded and fixed by a first sealer 10 applied thickly all over the upperfaces of two sides facing each other out of four sides and also a bonding face 1a of the module base 1. The first sealer 10 is so retained as to press down the periphery of the IC chip 2 to retain the proper bonded state. A second sealer 11 is flowed into a clearance between the IC chip 2 and the module base 1 to seal the clearance.