WIRE BONDING DEVICE

PROBLEM TO BE SOLVED: To smoothly guide a wire by forming a wire groove against which the wire is pressed and a wire cutting groove which is provided successively to the wire guide groove and has a cut forming blade forming a cut in the wire. SOLUTION: A wedge bonding tool 10 is formed of metal such...

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Bibliographic Details
Main Author OTANI KAZUMI
Format Patent
LanguageEnglish
Published 13.02.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To smoothly guide a wire by forming a wire groove against which the wire is pressed and a wire cutting groove which is provided successively to the wire guide groove and has a cut forming blade forming a cut in the wire. SOLUTION: A wedge bonding tool 10 is formed of metal such as super hardened alloy and its tip part has a 1st bottom surface 21 and a 2nd bottom surface 22 closer to the tip side than the 1st bottom surface 21 in steps. The 1st bottom surface has one end part bored as an insertion hole 10a. Further, the 2nd bottom surface 22 has the wire guide groove 23 for guiding the wire 11 slidably and the wire cutting groove 24 which is provided adjacently to the wire guide groove 23 in parallel and cuts the wire 11. Consequently, the wire guide groove smoothly guides the wire and the wire cutting groove speedily and securely cuts the wire.
Bibliography:Application Number: JP19960195901