MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SUBSTRATE CLEANER

PROBLEM TO BE SOLVED: To remove reaction byproducts produced in forming via-holes by jetting a warmed and ultrasonically vibrated pure water or hydrophilic solvent- contained cleaning liq. on the surface of a wafer rotating in a plane, and then by forming upper layer Al electrode wirings. SOLUTION:...

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Bibliographic Details
Main Authors UEHARA TADAO, HARUKI TORU, MIYAKE HIDEJI
Format Patent
LanguageEnglish
Published 13.02.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To remove reaction byproducts produced in forming via-holes by jetting a warmed and ultrasonically vibrated pure water or hydrophilic solvent- contained cleaning liq. on the surface of a wafer rotating in a plane, and then by forming upper layer Al electrode wirings. SOLUTION: While rotating a wafer 2 fixed to a wafer chuck 4 at 1,000rpm or more, pure water or isopropylalchol warmed by a temp. adjuster 14 over 40 deg.C is jetted on the wafer surface from a megasonic nozzle 8 being reciprocally moved in parallel to the wafer surface. A high frequency oscillator 10 gives an ultrasonic vibration to the cleaning liq. jetted from the nozzle. This ultrasonic vibration and centrifugal force due to the high speed rotation of the wafer 2 enhance the removable efficiency with a physical force acting on reaction byproducts to be removed.
Bibliography:Application Number: JP19960212086