SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent the occurrence of cracks during solder flow by providing a particular area among the whole volume of a heat-resistant adhesive film between inner lead and semiconductor element. SOLUTION: This semiconductor device has 80% or more of the whole volume of the heat-resis...

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Bibliographic Details
Main Authors HOSOKAWA YOICHI, IIOKA SHINJI, NOMURA YOSHIHIRO, TANABE YOSHIYUKI, KIRIHARA HIROSHI
Format Patent
LanguageEnglish
Published 08.12.1998
Edition6
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To prevent the occurrence of cracks during solder flow by providing a particular area among the whole volume of a heat-resistant adhesive film between inner lead and semiconductor element. SOLUTION: This semiconductor device has 80% or more of the whole volume of the heat-resistant adhesive film located between an inner lead and a semiconductor element. Because of this, an adhesive film is adhered directly to a metallic plate for lead frame before processing to lead frame, and when processing to inner lead, an adhesive film between the inner leads is cut off at the same time, or an adhesive film between the inner leads is cut off after adhering an adhesive film to the inner lead. By doing this, the lead frame with an adhesive film becomes a semiconductor device where a low adhesion portion between semiconductor chips, unadhered portion disappears, and the cracks of sealing resin caused by this portion will not occur.
Bibliography:Application Number: JP19970134689