PLATE TYPE FLUORESCENT LAMP

PROBLEM TO BE SOLVED: To prevent adhesive failure and slow leakage from being caused even if an excessive load by a twist, tension or the like acts on lead wires by filling an expoxy resin at the root where the lead wires installed on electrodes project from a sealed vessel formed by adhering an upp...

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Bibliographic Details
Main Authors SHIBAOKA KAZUO, OZAKI MITSUYA
Format Patent
LanguageEnglish
Published 04.12.1998
Edition6
Subjects
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Summary:PROBLEM TO BE SOLVED: To prevent adhesive failure and slow leakage from being caused even if an excessive load by a twist, tension or the like acts on lead wires by filling an expoxy resin at the root where the lead wires installed on electrodes project from a sealed vessel formed by adhering an upper surface glass substrate and an under surface glass substrate by low melting point glass. SOLUTION: A sheet-like upper surface glass substrate 1 and a tray-shaped under surface glass substrate 2 are adhered together by fusion of low melting point glass, and a sealed vessel is formed, and electrodes 6 and 7 are arranged inside of it. In lead wires 3 and 4, one end is installed on the electrodes 6 and 7, and the other end is projected outside through the glass substrates 1 and 2. In a sealing structure of the lead wires 3 and 4 and the glass substrates 1 and 2, the lead wires 3 and 4 extending in a straight line shape are fused in a sealing width W on the glass substrates 1 and 2 by low melting point glass 8, and an epoxy resin 10 is also filled at the root of the lead wires 3 and 4 projecting from the glass substrates 1 and 2.
Bibliography:Application Number: JP19970132187