WALL SURFACE PANEL DEVICE

PROBLEM TO BE SOLVED: To provide a wall surface panel device capable of rigidly installing onto columns. SOLUTION: A column 3 is structured so that it is provided with a holding part 14 of roughly T-shaped section at least on the front side of a column part 13, an installation hole 61 at the top of...

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Bibliographic Details
Main Authors AZUMA TOSHIHIKO, IDA TATSUMI
Format Patent
LanguageEnglish
Published 02.12.1998
Edition6
Subjects
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Summary:PROBLEM TO BE SOLVED: To provide a wall surface panel device capable of rigidly installing onto columns. SOLUTION: A column 3 is structured so that it is provided with a holding part 14 of roughly T-shaped section at least on the front side of a column part 13, an installation hole 61 at the top of a side surface, a panel 5 is provided with an engaging edge 17 for close-fitting to the holding part on both edges, and an engaging hole 59 is provided at the end part of an upper edge plate 16. Also a roof connecting device 9 forms an opening part 53 which receives the neck part 14A of the holding part 14 from the center part to the bottom end of a substrate 52 connected to the front or rear surface of the column part 13 from which the holding part 14 is projected, and forms a retaining plate 54 outwardly at the top end of the substrate 52, a downward engagement claw 55 at both end front edges of the retaining plate 54, a restricting plate 57 connected to both side surfaces of the column part 13, and a return stop claw 58. In addition, the neck part of the holding part 14 of the column 13 is received into the opening part 53 of the roof connecting device 9, the column part 13 is held by the substrate 52 and both restricting plates 57, both downward engagement claws 55 are inserted fixedly into the engagement holes 57 in the adjacent panels, and the upper edge plate of the panel is retained by the retaining plate 54. At the same time, each return stop claw 58 is engaged with a corresponding installation hole 61 under return stop condition.
Bibliography:Application Number: JP19970127711