MULTILAYERED PRINTED BOARD AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To turn a through-hole into a blind hole without carrying out a filling process, where ink material or the like is used so as to surface-mount a part even on the through-hole. SOLUTION: This printed board has a structure such that its base materials 1 and 2 are laminated throug...

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Bibliographic Details
Main Author AKAI SHINICHI
Format Patent
LanguageEnglish
Published 24.11.1998
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To turn a through-hole into a blind hole without carrying out a filling process, where ink material or the like is used so as to surface-mount a part even on the through-hole. SOLUTION: This printed board has a structure such that its base materials 1 and 2 are laminated through the intermediary of a prepreg 3, and a through- hole 4 is provided so as to electrically connect the prescribed circuit parts of the boards 1 and 2 together, wherein a conductive paste 5 is filled only in a part of the through-hole 4 located at the prepreg 3 to turn the through-hole into a blind hole. A copper plating layer 6 is formed on circuit patterns formed on the outer surfaces of the boards 1 and 2, the conductive paste 5, and the inner walls of the blind holes provided to the boards 1 and 2, whereby the circuit patterns formed on the outer surfaces of the boards 1 and 2 and the conductive paste 5 are electrically connected together via the copper plating layer 6.
Bibliography:Application Number: JP19970137604