METHOD FOR FORMING CONDUCTIVE POLYMERIC MEMBRANE

• Main Authors: NAGAI MIZUKI, TAKANO HISAO, KAMIYAMA KOJI
• Format: Patent
• Language: English
• Published: 17.11.1998
• Edition: 6
• Subjects: ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; HETEROCYCLIC COMPOUNDS; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS

PROBLEM TO BE SOLVED: To form a good conductive polymeric membrane by forming a manganese oxide layer on the surface of an insulation material, immersing the assemblage in an aqueous solution containing a monomer comprising a sulfur-or nitrogen-containing five-membered heterocyclic group and immersing the product of immersion in an acidic solution containing an organic acid or its salt and an inorganic acid. SOLUTION: The oxide used in oxidation pretreatment carried out to make an insulation substrate electrically conductive is exemplified by potassium permanganate or sodium permanganate and is used in a concentration ranging from 30 g/l to its solubility. The pH of this solution is 5.0-9.0, and the pretreatment is carried out at 60-95 deg.C. The pH adjustment is carried out by using sulfuric acid. The buffer used is boric acid or a borate and is used in a concentration ranging from 0.1 g/l to its solubility, desirably from 1 to 20 g/l. The insulation substrate is immersed in an organic-monomer-containing organic solvent solution for 1-2 min at room temperature, and the monomer is thiophene or its derivative and is used in a concentration of 0.1-100 wt.%. After the action of a catalyst, oxidation after-treatment is performed to condition the substrate for copper electroplating.