CURING AGENT FOR EPOXY RESIN

PROBLEM TO BE SOLVED: To obtain a curing agent which can provide a high curing rate even at low temperatures and can give a cured epoxy resin having good appearance, adhesion, water resistance and chemical resistance by reacting 2,5- and 2,6-bis(aminomethyl)bicyclo[2.2.1]heptane (NBDA) with an epoxy...

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Bibliographic Details
Main Authors ABE TAKEYA, SHIMIZU TAKUJI, ASANO TAMOTSU
Format Patent
LanguageEnglish
Published 04.11.1998
Edition6
Subjects
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Summary:PROBLEM TO BE SOLVED: To obtain a curing agent which can provide a high curing rate even at low temperatures and can give a cured epoxy resin having good appearance, adhesion, water resistance and chemical resistance by reacting 2,5- and 2,6-bis(aminomethyl)bicyclo[2.2.1]heptane (NBDA) with an epoxy resin and adding benzyl alcohol to the reaction product. SOLUTION: The epoxy resin used has an epoxy equivalent of 150-600 g/eq, contains at least two epoxy groups in the molecule and is liquid of semisolid. It is suitable that the reaction of NBDA with the epoxy resin is performed by setting the ratio between the reactants so that the product may contain active aminic hydrogen atoms, and the 0.025-0.50 equivalent of the epoxy groups of the epoxy resin are used per equivalent of the active hydrogen atoms of the amino groups of NBDA. The reaction temperature is 40-120 deg.C. The amount of the benzyl alcohol added is 0.5-100 g per 100 g of the reaction product. The amount of the curing agent added is 10-200 pts.wt. per 100 pts.wt. epoxy resin.
Bibliography:Application Number: JP19970102079