WIRE BONDING TERMINAL AND MANUFACTURE THEREOF

• Main Authors: SUZUKI TOSHIO, IMAI HIROKAZU, NOMURA KAZUHITO
• Format: Patent
• Language: English
• Published: 27.10.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To obtain a flat plating suitable for wire bonding without causing high costs and with an improved durability and productivity, when a terminal is plated with nickel. SOLUTION: When it is desired to plate a terminal material with nickel, brightener is not used because it contains a sulfur content. From a viewpoint of improving productivity, in order to continuously plate the terminal material with nickel, a sulfamic acid bath is suitable. For this reason, the nickel plating is carried out with use of the sulfamic acid bath without using the brightener. In this case, in order to ensure wire bonding to the nickel-plated terminal, it is necessary for a nickel film to have a surface roughness of 0.6 μmRz or less. Thus, when the nickel plating is carried out with use of the sulfamic acid bath without using the brightener, a current density is controlled to have a predetermined value.