SUBSTRATE RETAINING APPARATUS AND SUBSTRATE TREATMENT APPARATUS USING SUBSTRATE RETAINING APPARATUS

PROBLEM TO BE SOLVED: To provide a substrate retaining apparatus generating less dusts and having a wide allowance for dispersion in substrate supply positions. SOLUTION: Retention rollers 13, 33 is formed of generally double enveloping shape, with a constricted side portion near the center thereof...

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Bibliographic Details
Main Authors KOMATSUBARA SHOJI, OKUDA YASUHIKO, SAWADA ATSUSHI
Format Patent
LanguageEnglish
Published 27.10.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a substrate retaining apparatus generating less dusts and having a wide allowance for dispersion in substrate supply positions. SOLUTION: Retention rollers 13, 33 is formed of generally double enveloping shape, with a constricted side portion near the center thereof being a cylindrical surface 101 having a vertical width d1 slightly larger than the thickness t of a wafer W. The lower end periphery of the cylindrical surface 101 is continuous to a lower conical surface 102 which is wider downward. The upper end periphery of the cylindrical surface 101 is continuous to an upper conical surface 103 which is wider upward. The wafer W to be cleaned is retained by the retention rollers 13, 33 with the end face of the wafer W contacting the cylindrical surface 101 formed at the retention rollers 13, 33.
Bibliography:Application Number: JP19970099346