MANUFACTURE OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device having, high reliability and productivity by a method wherein a stable-shaped elastomer layer is formed, while maintaining the thermal stress alleviating action, which is the intrinsic function of an elastomer. SOLUT...

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Bibliographic Details
Main Authors NOKITA KANTA, OKAMOTO HISATO
Format Patent
LanguageEnglish
Published 23.10.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device having, high reliability and productivity by a method wherein a stable-shaped elastomer layer is formed, while maintaining the thermal stress alleviating action, which is the intrinsic function of an elastomer. SOLUTION: In a process, wherein an elastomer layer is formed on a flexible substrate 2 of this manufacturing method, an elastomer 4, which is injected into a molded plate 20, is heated up from a bottom face 4b to a side edge face 4a of the elastomer 4 by a heating device 100, and the side face 4b and a side edge face 4a of the elastomer 4 are hardened.
Bibliography:Application Number: JP19970089555