PHOTOSENSITIVE RESIN COMPOSITION

• Main Authors: ONO KAZUYOSHI, TANAKA JUNSUKE
• Format: Patent
• Language: English
• Published: 23.10.1998
• Edition: 6
• Subjects: ADHESIVES; APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; CINEMATOGRAPHY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; FILLING PASTES; HOLOGRAPHY; INKS; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS

PROBLEM TO BE SOLVED: To provide an insulating film and a solder resist film composed of the photosensitive resin material superior in heat resistance and heat shock resistance in soldering, and enhanced in usefulness as the insulating film forming material of a printed circuit board. SOLUTION: This photosensitive composition is obtained by allowing the reaction product of a dicyclopentadiene type epoxy compound represented by the formula to react with a saturated or unsaturated polybasic acid anhydride and further incorporating an epoxy resin and a photopolymerization initiator and a thermosetting accelerator and an ethylenically unsaturated compound. A metallic, plastic and ceramic product are provided with films composed of the photosensitive resin.