WINDING OF BONDING WIRE

• Main Author: KUBO TOSHIYUKI
• Format: Patent
• Language: English
• Published: 27.01.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES; PACKING; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; STORING; TRANSPORTING

PROBLEM TO BE SOLVED: To prevent winding from collapsing and to increase the amount of the winding to enhance the workability of a bonding work by a method wherein the first layer of winding is wound on a spool in a prescribed length and at a prescribed winding pitch with the center of the winding surface of the spool as the center of a winding surface for the winding and the second and later layers are wound at a prescribed spreading pitch in such a way the width increase. SOLUTION: First, one layer of a gold wire 2 is wound on a spool in a prescribed winding length 1. Then, a gold wire 3 is wound on the gold wire 2. That is, the first layer gold wire 2 is wound on the spool in a prescribed length and at a prescribed winding pitch with the center of the winding surface of the spool as the center of a winding surface for the winding wires and the second and later layers of gold wires are wound in such a way as to wind-spread at a prescribed spreading pitch. In such a way, as the lower layer parts of the gold wires are surely covered with the upper layer parts of the gold wires, the gold wires hardly collapse even if there are a strong shock and vibrations when the spool is erected or during the carrying of the spool. Thereby, the winding amount of the gold wires is increased and the workability of a bonding work can be made to enhance.