MANUFACTURE OF HARD SUBSTRATE AND ITS DEVICE

PROBLEM TO BE SOLVED: To provide the manufacture of a hard substrate and its device, which can obtain both the advantages of contact polishing with polishing cloth and float polishing in contact with polishing liquids, and thereby improve surface defects to a great extent. SOLUTION: Polishing is per...

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Bibliographic Details
Main Authors HASHIGUCHI ERIKO, KAWATE KENJI
Format Patent
LanguageEnglish
Published 20.10.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide the manufacture of a hard substrate and its device, which can obtain both the advantages of contact polishing with polishing cloth and float polishing in contact with polishing liquids, and thereby improve surface defects to a great extent. SOLUTION: Polishing is performed while load is being applied to a work 10 by a holder part 6. Just before contact polishing is over, a discharge valve 5 is closed. A liquid sump of polishing liquids 71 is formed over the upper surface of polishing cloth 2. Load applied by the holder 6 is removed, and the work 10 is gradually released from the polishing cloth 2. The work 10 is so held as to be stopped at a position where a suitable water film is formed between the work 10 and the polishing cloth 2. The work 10 is released from the polishing cloth 2 so as to allow float polishing to be performed. Oscillation in the horizontal direction is given over to the outer circumferential direction from the center of a level block 1. Rinse water 72 is fed over to the polishing cloth 2 in place of polishing liquids 71.
Bibliography:Application Number: JP19970079323