LEAD FORMING DEVICE FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a lead forming device in which productivity can be enhanced by suppressing defective shapes of a lead effectively. SOLUTION: The lead forming step for an object M to be machined, i.e., a semiconductor device, is followed by a step for inspecting the shape of the lead...

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Bibliographic Details
Main Author ABE YASUNORI
Format Patent
LanguageEnglish
Published 09.10.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:PROBLEM TO BE SOLVED: To provide a lead forming device in which productivity can be enhanced by suppressing defective shapes of a lead effectively. SOLUTION: The lead forming step for an object M to be machined, i.e., a semiconductor device, is followed by a step for inspecting the shape of the lead of the object M to be machined (semiconductor device) by means of an inspection unit 20. The object M to be machined (semiconductor device) is transferred while being sucked along a series of flow from the shaping of lead to the inspection of the shape of lead.
Bibliography:Application Number: JP19970075576