METHOD OF FORMING II-VI COMPOUND SEMICONDUCTOR AND GROUP VI MATERIAL FOR VAPOR GROWTH OF II-VI COMPOUND SEMICONDUCTOR
PROBLEM TO BE SOLVED: To manufacture a II-VI compound semiconductor epitaxial wafer whose hillock density is specified, by forming II-VI compound semiconductor by using compound expressed by specific formulas. SOLUTION: Compound expressed by a formula I is used as group VI element material. In the f...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
09.10.1998
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To manufacture a II-VI compound semiconductor epitaxial wafer whose hillock density is specified, by forming II-VI compound semiconductor by using compound expressed by specific formulas. SOLUTION: Compound expressed by a formula I is used as group VI element material. In the formula I, X is one out of Si, Ge, and Sn, Y is one out of Se and S; R , R and R are hydrogen or C1-C6 hydrocarbon groups, and R4 is a C1-C2 hydrocarbon group. Compound expressed by a formula II is used as group VI element material. In the formula II, X is one out of Si, Ge and Sn, Y is one out of Se and S, and R , R , R , R , R and R are hydrogen or C1-C6 hydrocarbon groups. Thereby a II-VI compound semiconductor epitaxial wafer whose hillock density is smaller than 10/cm can be manufactured. |
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Bibliography: | Application Number: JP19970087535 |