METAL SURFACE TREATING SOLUTION AND SURFACE TREATED METAL PLATE

• Main Authors: YAMAZAKI MAKOTO, JITSUHARA IKUO
• Format: Patent
• Language: English
• Published: 22.09.1998
• Edition: 6
• Subjects: ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DIFFUSION TREATMENT OF METALLIC MATERIAL; DYES; FILLING PASTES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; INKS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS

PROBLEM TO BE SOLVED: To obtain the subject treating agent excellent in corrosion resistance and adhesion without using hexavalent chromium at all, by specifying a composition of a polyaniline and/or its derivative, a resin and an inorganic oxide. SOLUTION: This composition comprises a mixture of (A) a resin, (B) a polyaniline and/or its derivative and (C) an inorganic oxide in the weight ratio of the component B to the component A of 0.1-20% and the component C to the weight of the component A of 1-40%. Preferably a water-soluble or water- dispersible acrylic resin is used, for example, as the component A, a compound of the formula (X1 to X3 are each H, sulfo, carboxyl, etc.; Y1 to Y3 are each H, an alkyl, methoxy, etc.; (m) and (n) are each a positive number) is used as the component B and colloidal SiO2 , etc., are used as the component C.