GLASS FIBER WOVEN FABRIC FOR PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To obtain a glass fiber woven fabric for printed circuit boards, capable of preventing a phenomenon called a waving phenomenon generated on the production of a prepreg from a glass fiber woven fabric produced by the use of an air jet loom, and capable of producing the prepreg f...

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Bibliographic Details
Main Author KOYANAGI RYOTA
Format Patent
LanguageEnglish
Published 14.09.1998
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LOOMS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METHODS OF WEAVING
PRINTED CIRCUITS
TEXTILES
WEAVING
WOVEN FABRICS
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Summary:PROBLEM TO BE SOLVED: To obtain a glass fiber woven fabric for printed circuit boards, capable of preventing a phenomenon called a waving phenomenon generated on the production of a prepreg from a glass fiber woven fabric produced by the use of an air jet loom, and capable of producing the prepreg free from wrinkles, splits, etc. SOLUTION: In this glass fiber woven fabric for printed circuit boards, the diameter of each of filaments constituting a weft is larger by 20-80% than the diameter of each of filaments constituting the warp, and the number of the filaments constituting the weft is smaller by 30-70% than the number of the filaments constituting the warp.
Bibliography:Application Number: JP19970058622