MULTILAYERED PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To prevent unevenness of inner layer material from appearing on the surface of an outer layer, by using a double-sided copper clad film as the inner layer material which film is formed by sticking copper foils on both surfaces of a heat-resistant plastic film, via adhesive agen...

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Bibliographic Details
Main Authors IKEDA KENICHI, TANAKA MASASHI, SUZUKI TAKAYUKI, TANABE TAKAHIRO
Format Patent
LanguageEnglish
Published 23.01.1998
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To prevent unevenness of inner layer material from appearing on the surface of an outer layer, by using a double-sided copper clad film as the inner layer material which film is formed by sticking copper foils on both surfaces of a heat-resistant plastic film, via adhesive agent which contains, as essential ingredient, bifunctional or more epoxy resin and high molecular weight epoxy polymer capable of forming a film, SOLUTION: On both surfaces of a heat-resistant plastic film, excellent adhesion and resin flow characteristics are obtained by setting the compound ratio of bifunctional or more epoxy resin and high molecular weight epoxy polymer capable of forming a film, as 100wt.% of high molecular epoxy polymer and 10-50wt.% of epoxy resin in which the total amount is at least 30wt.% of the whole adhesive agent component. By heating and pressing a double-sides copper clad film (interposing heat-resistant plastic films as inner layer material, outside the double-sided copper clad film, via adhesive agent cured until a B stage), with an oilhydraulic press, unevenness of the inner layer material can be prevented from appearing on the surface of an outer layer.
Bibliography:Application Number: JP19960173570