DIRECT-ACTING MECHANISM

• Main Authors: HARA KAZUTAKA, HISADA JIRO, TOMITA YOSHIYUKI
• Format: Patent
• Language: English
• Published: 21.08.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To obtain a direct-acting mechanism in which an object to be treated is hardly subjected to the influence of a thermal strain due to heating and which restrains the generation of dust particles inside a treatment container by a method wherein the direct-acting mechanism which is provided with a holding means used to hold the object to be treated is attached to a support shaft for drive. SOLUTION: A holding base 10 is arranged inside a treatment container 1, and the holding base 10 is fixed to support shafts 2A, 2B for drive. In addition, a plurality of pins 12 are made to protrude on the surface of the holding base 10, and a substrate 13 is placed on the pins 12. In addition, a heater 11 is buried at the inside of the holding base 10, the holding base 10 is heated, the substrate 13 is heated by its thermal radiation or the like, and, at the same time, a laser beam is introduced into the treatment container 1 through a quartz window 14 formed on the surface of the treatment container 1. Then, a linear motor 6 is driven, the support shafts 2A, 2B for drive are moved to their axial direction, and the substrate 13 is moved rectilinearly inside the treatment container 1. Thereby, a sliding part is hardly subjected to the influence of a thermal strain, and it is possible to restrain a contamination inside the treatment container 1.