BONDING DEVICE

PROBLEM TO BE SOLVED: To obtain a bonding device suitable for face-down mounting of a flip chip system semiconductor device on a circuit board, for example. SOLUTION: A sub-slide plate 26, holding the ultrasonic wave horn 10 where a chip 1 retaining tool 11 is attached, is suspended elastically on t...

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Bibliographic Details
Main Authors KOBAYASHI DAISUKE, OTANI KAZUMI
Format Patent
LanguageEnglish
Published 21.08.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To obtain a bonding device suitable for face-down mounting of a flip chip system semiconductor device on a circuit board, for example. SOLUTION: A sub-slide plate 26, holding the ultrasonic wave horn 10 where a chip 1 retaining tool 11 is attached, is suspended elastically on the main slide plate 21 in a vertically movable manner in this bonding device. As a result, this ultraonic wave horn 10 does not incline even when the tool 11 is brought into contact with a substrate 2 by lowering the main slide plate 21, and a highly reliable ultrasonic wave bonding operation can be conducted by a uniform pressure bonding strength.
Bibliography:Application Number: JP19970022234